Publication detail

Design of a device for measuring the electrical resistance of soldered joints during fatigue tests

KOPŘIVA, P. OTÁHAL, A.

Original Title

Design of a device for measuring the electrical resistance of soldered joints during fatigue tests

Type

conference paper

Language

English

Original Abstract

This document deals with design of device capable of measuring electrical resistance of solder joints during fatigue testing. It contains theory behind fatigue testing, chosen parameters, design, and construction of the measuring device.

Keywords

BGA package, Design, DPS, Fatigue tests, joints, Resistance measurement, Solder

Authors

KOPŘIVA, P.; OTÁHAL, A.

Released

23. 4. 2024

Publisher

Brno University of Technology, Faculty of Electrical Engineering and Communication

Location

Brno

ISBN

978-80-214-6231-1

Book

Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers

Edition

1

Pages from

155

Pages to

158

Pages count

4

URL

https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf

BibTex

@inproceedings{BUT198185,
  author="Pavel {Kopřiva} and Alexandr {Otáhal}",
  title="Design of a device for measuring the electrical resistance of soldered joints during fatigue tests",
  booktitle="Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers",
  year="2024",
  series="1",
  pages="155--158",
  publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  address="Brno",
  isbn="978-80-214-6231-1",
  url="https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf"
}