Detail publikace

Design of a device for measuring the electrical resistance of soldered joints during fatigue tests

KOPŘIVA, P. OTÁHAL, A.

Originální název

Design of a device for measuring the electrical resistance of soldered joints during fatigue tests

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This document deals with design of device capable of measuring electrical resistance of solder joints during fatigue testing. It contains theory behind fatigue testing, chosen parameters, design, and construction of the measuring device.

Klíčová slova

BGA package, Design, DPS, Fatigue tests, joints, Resistance measurement, Solder

Autoři

KOPŘIVA, P.; OTÁHAL, A.

Vydáno

23. 4. 2024

Nakladatel

Brno University of Technology, Faculty of Electrical Engineering and Communication

Místo

Brno

ISBN

978-80-214-6231-1

Kniha

Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers

Edice

1

Strany od

155

Strany do

158

Strany počet

4

URL

https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf

BibTex

@inproceedings{BUT198185,
  author="Pavel {Kopřiva} and Alexandr {Otáhal}",
  title="Design of a device for measuring the electrical resistance of soldered joints during fatigue tests",
  booktitle="Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers",
  year="2024",
  series="1",
  pages="155--158",
  publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  address="Brno",
  isbn="978-80-214-6231-1",
  url="https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf"
}