Publication result detail
Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation
TRIVEDI, R.; HOFEREK, L.; ČECH, V.
Original Title
Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation
English Title
Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation
Type
Peer-reviewed article not indexed in WoS or Scopus
Original Abstract
Plasma-polymerized tetravinylsilane films deposited on silicon wafers by PECVD at different powers using pulsed plasma were analyzed by both typical conventional depth sensing and by cyclic nanoindentation. A comparative study of the two methods was carried out under reduced system drift. It was found that cyclic nanoindentation is a reproducible technique enabling reliable construction of the depth profile of mechanical properties to the same degree of accuracy as conventional nanoindentation but considerably faster. The Youngs modulus (7.9-17 GPa) and hardness (0.69-3.0 GPa) of films were controlled by the effective power (0.1-10 W). Conditions for appropriate depth analysis of mechanical properties at shallow depth and the limited applicability of the 10% rule are also discussed.
English abstract
Plasma-polymerized tetravinylsilane films deposited on silicon wafers by PECVD at different powers using pulsed plasma were analyzed by both typical conventional depth sensing and by cyclic nanoindentation. A comparative study of the two methods was carried out under reduced system drift. It was found that cyclic nanoindentation is a reproducible technique enabling reliable construction of the depth profile of mechanical properties to the same degree of accuracy as conventional nanoindentation but considerably faster. The Youngs modulus (7.9-17 GPa) and hardness (0.69-3.0 GPa) of films were controlled by the effective power (0.1-10 W). Conditions for appropriate depth analysis of mechanical properties at shallow depth and the limited applicability of the 10% rule are also discussed.
Keywords
Thin film, plasma polymerization, nanoindentation, Youngs modulus, hardness
Key words in English
Thin film, plasma polymerization, nanoindentation, Youngs modulus, hardness
Authors
TRIVEDI, R.; HOFEREK, L.; ČECH, V.
RIV year
2012
Released
31.12.2011
ISBN
0257-8972
Periodical
SURFACE & COATINGS TECHNOLOGY
Volume
205
Number
S2
State
Swiss Confederation
Pages from
470
Pages to
474
Pages count
5
BibTex
@article{BUT89393,
author="Rutul Rajendra {Trivedi} and Lukáš {Hoferek} and Vladimír {Čech}",
title="Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation",
journal="SURFACE & COATINGS TECHNOLOGY",
year="2011",
volume="205",
number="S2",
pages="470--474",
issn="0257-8972"
}