Detail publikačního výsledku
Plasma Enhanced Chemical Vapour Deposition of SiO2-Like Films: Monitoring and Optimization of the Process
PROCHÁZKA, M.; BLAHOVÁ, L.; KRČMA, F.; PŘIKRYL, R.
Originální název
Plasma Enhanced Chemical Vapour Deposition of SiO2-Like Films: Monitoring and Optimization of the Process
Anglický název
Plasma Enhanced Chemical Vapour Deposition of SiO2-Like Films: Monitoring and Optimization of the Process
Druh
Abstrakt
Originální abstrakt
This work focuses on high density thin films deposited by PECVD using hexamethyldisiloxane precursor. Optical emission spectroscopy was used for plasma diagnostics. Oxygen transmission rate and infrared spectra of deposited layers were measured. Optimal experimental conditions for low carbon content layers and layers with good barrier properties were determined.
Anglický abstrakt
This work focuses on high density thin films deposited by PECVD using hexamethyldisiloxane precursor. Optical emission spectroscopy was used for plasma diagnostics. Oxygen transmission rate and infrared spectra of deposited layers were measured. Optimal experimental conditions for low carbon content layers and layers with good barrier properties were determined.
Klíčová slova
Thin film deposition, optical emission spectroscopy, oxygen transmission rate
Klíčová slova v angličtině
Thin film deposition, optical emission spectroscopy, oxygen transmission rate
Autoři
PROCHÁZKA, M.; BLAHOVÁ, L.; KRČMA, F.; PŘIKRYL, R.
Vydáno
07.12.2012
Nakladatel
FCH VUT
Místo
Brno
ISBN
978-80-214-4545-8
Kniha
Studentská konference Chemie je život – Sborník abstraktů
Strany od
120
Strany do
120
Strany počet
1
Plný text v Digitální knihovně
BibTex
@misc{BUT101784,
author="Michal {Procházka} and Lucie {Janů} and František {Krčma} and Radek {Přikryl}",
title="Plasma Enhanced Chemical Vapour Deposition of SiO2-Like Films: Monitoring and Optimization of the Process",
booktitle="Studentská konference Chemie je život – Sborník abstraktů",
year="2012",
pages="120--120",
publisher="FCH VUT",
address="Brno",
isbn="978-80-214-4545-8",
note="Abstract"
}