Anisotropic film construction using plasma nanotechnology (atomic polymerization)

Anisotropic film construction using plasma nanotechnology (atomic polymerization)

Abstrakt

Bilayers consisting of a-SiC:H and a-SiOC:H alloys were deposited on silicon wafer using plasma-enhanced chemical vapor deposition (PECVD). The layered structures were subjected to ellipsometric measurements that enabled us to distinguish individual layers and determine the layer thickness and its optical constants. In next study, single layer and multilayered a-SiC:H films, deposited from tetravinylsilane at different powers by PECVD, were investigated intensively by spectroscopic ellipsometry, nanoindentation, and atomic force microscopy (AFM) to compare optical and mechanical properties of the individual layer of decreased thickness (315 - 25 nm) with those of the corresponding single layer.

Bilayers consisting of a-SiC:H and a-SiOC:H alloys were deposited on silicon wafer using plasma-enhanced chemical vapor deposition (PECVD). The layered structures were subjected to ellipsometric measurements that enabled us to distinguish individual layers and determine the layer thickness and its optical constants. In next study, single layer and multilayered a-SiC:H films, deposited from tetravinylsilane at different powers by PECVD, were investigated intensively by spectroscopic ellipsometry, nanoindentation, and atomic force microscopy (AFM) to compare optical and mechanical properties of the individual layer of decreased thickness (315 - 25 nm) with those of the corresponding single layer.

plasma polymerization, thin films

plasma polymerization, thin films

HOFEREK, L.; TRIVEDI, R.; MISTRÍK, J.; ČECH, V.

2011

27.12.2010

IC-Plants 2010

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