Detail publikace

The influence of current on the structure of the intermetallic compound in solder alloys

SKÁCEL, J. OTÁHAL, A.

Originální název

The influence of current on the structure of the intermetallic compound in solder alloys

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

This paper investigates the impact of applied current on the structure of Cu6Sn5 and Cu3Sn intermetallic layers and compounds within the volume of the SAC305 solder alloy. The study focuses on the transition region between a copper electrode and the solder alloy. Direct current at magnitudes of 25 A and 30 A was applied for durations of 30 and 90 minutes, alongside samples fabricated without current application. After the samples were prepared, the surfaces were refined through sanding and subsequent polishing with diamond pastes. To enhance the quality of data obtained from these samples, the surfaces were etched, improving the visibility of their microstructure. Statistical analysis of the intermetallic layer thickness at the Cu electrode-solder alloy interface was conducted. The results revealed a significant influence of applied current on the width of the intermetallic layers. Measurements demonstrated a polarity-dependent effect on the layer thickness, that samples formed under current exhibiting substantially thicker layers at the positive electrode compared to the negative electrode. Additionally, the samples with applied current showed a significant increase in the size of intermetallic compounds within the solder alloy, reaching dimensions of several millimeters. The final part of the research involved elemental analysis to confirm the composition of the intermetallic compounds. This analysis validated the presence of Cu6Sn5 and Cu3Sn.

Klíčová slova

SAC305; intermetallic compound; intermetallic layer; Cu6Sn5; Cu3Sn

Autoři

SKÁCEL, J.; OTÁHAL, A.

Vydáno

1. 2. 2025

Nakladatel

SLOVAK UNIV TECHNOLOGY

Místo

BRATISLAVA

ISSN

1335-3632

Periodikum

Journal of Electrical Engineering

Ročník

76

Číslo

1

Stát

Slovenská republika

Strany od

48

Strany do

57

Strany počet

10

URL

https://www.webofscience.com/wos/woscc/full-record/WOS:001419692600002

BibTex

@article{BUT198153,
  author="Josef {Skácel} and Alexandr {Otáhal}",
  title="The influence of current on the structure of the intermetallic compound in solder alloys",
  journal="Journal of Electrical Engineering
",
  year="2025",
  volume="76",
  number="1",
  pages="48--57",
  doi="10.2478/jee-2025-0005",
  issn="1335-3632",
  url="https://www.webofscience.com/wos/woscc/full-record/WOS:001419692600002"
}