Detail publikace

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

TRIVEDI, R. ČECH, V.

Originální název

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

Klíčová slova

plasma polymerization; thin films; nanoindentation

Autoři

TRIVEDI, R.; ČECH, V.

Rok RIV

2010

Vydáno

27. 12. 2010

ISSN

0257-8972

Periodikum

Surface and Coatings Technology

Ročník

205

Číslo

Suppl 1

Stát

Švýcarská konfederace

Strany od

286

Strany do

289

Strany počet

4

BibTex

@article{BUT50758,
  author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
  journal="Surface and Coatings Technology",
  year="2010",
  volume="205",
  number="Suppl 1",
  pages="286--289",
  issn="0257-8972"
}